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notice for taiyo yuden products please read this notice before using the taiyo yuden products. reminders p r o d u c t i n fo r m a t i o n i n t h i s c a t a l o g i s a s o f o c t o b e r 2 0 1 3 . a l l o f t h e c o n t e n t s s p e c i ? e d h e r e i n a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e d u e t o t e c h n i c a l i m p r o v e m e n t s , e t c . t h e r e fo r e , p l e a s e c h e c k fo r t h e l a t e s t i n fo r m a t i o n c a r e f u l l y b e - fo r e p r a c t i c a l a p p l i c a t i o n o r u s a g e o f t h e p r o d u c t s . p l e a s e n o t e t h a t t a i y o y u d en c o . , l t d . s h a l l n o t b e r e s p o n s i b l e fo r a n y d e f e c t s i n p r o d u c t s o r e q u i p m e n t i n c o r - p o r a t i n g s u c h p r o d u c t s , w h i c h a r e c a u s e d u n d e r t h e c o n d i t i o n s o t h e r t h a n t h o s e s p e c i ? e d i n t h i s c a t a l o g o r i n d i - v i d u a l s p e c i ? c a t i o n . p l e a s e c o n t a c t t a i y o y u d en c o . , l t d . fo r f u r t h e r d e t a i l s o f p r o d u c t s p e c i ? c a t i o n s a s t h e i n d i v i d u a l s p e c i ? c a t i o n i s a v a i l a b l e . p l e a s e c o n d u c t v a l i d a t i o n a n d v e r i ? c a t i o n o f p r o d u c t s i n a c tu a l c o n d i t i o n o f m o u n t i n g a n d o p e r a t i n g e n v i r o n m e n t b e fo r e c o m m e r c i a l s h i p m e n t o f t h e e q u i p m e n t . a l l e l e c t r o n i c c o m p o n e n t s o r f u n c t i o n a l m o d u l e s l i s t e d i n t h i s c a t a l o g a r e d e v e l o p e d , d e s i g n e d a n d i n t e n d e d fo r u s e i n g e n e r a l e l e c t r o n i c s e q u i p m e n t . ( f o r a v , o f f i c e a u t o m a t i o n , h o u s e h o l d , o f f i c e s u p p l y , i n f o r m a t i o n s e r v i c e , t e l e c o m m u n i c a t i o n s , ( s u c h a s m o b i l e p h o n e o r p c ) e t c . ) . b e fo r e i n c o r p o r a t i n g t h e c o m p o n e n t s o r d e v i c e s i n t o a n y e q u i p m e n t i n t h e ? e l d s u c h a s t r a n s p o r t a t i o n , ( a u t o m o t i v e c o n t r o l , t r a i n c o n t r o l , s h i p c o n t r o l ) , t r a n s p o r t a t i o n s i g n a l , d i s a s t e r p r e v e n t i o n , m e d i c a l , p u b l i c i n fo r m a t i o n n e t w o r k ( t e l e p h o n e e x c h a n g e , b a s e s t a t i o n ) e t c . w h i c h m a y h a v e d i r e c t i n ? u e n c e t o h a r m o r i n j u r e a h u m a n b o d y , p l e a s e c o n t a c t t a i y o y u d en c o . , l t d . fo r m o r e d e t a i l i n a d - v a n c e . d o n o t i n c o r p o r a t e t h e p r o d u c t s i n t o a n y e q u i p m e n t i n ? e l d s s u c h a s a e r o s p a c e , a v i a t i o n , n u c l e a r c o n t r o l , s u b m a - r i n e s y s t e m, m i l i t a r y , e t c . w h e r e h i g h e r s a f e t y a n d r e l i a b i l i t y a r e e s p e c i a l l y r e q u i r e d . i n a d d i t i o n , e v e n e l e c t r o n i c c o m p o n e n t s o r f u n c t i o n a l m o d u l e s t h a t a r e u s e d fo r t h e g e n e r a l e l e c t r o n i c e q u i p m e n t , i f t h e e q u i p m e n t o r t h e e l e c t r i c c i r c u i t r e q u i r e h i g h s a f e t y o r r e l i a b i l i t y f u n c t i o n o r p e r fo r m a n c e s , a s u f ? c i e n t r e l i a b i l - i t y e v a l u a t i o n c h e c k fo r s a f e t y s h a l l b e p e r fo r m e d b e fo r e c o m m e r c i a l s h i p m e n t a n d m o r e o v e r , d u e c o n s i d e r a t i o n t o i n s t a l l a p r o t e c t i v e c i r c u i t i s s t r o n g l y r e c o m m e n d e d a t c u s t o m e r ' s d e s i g n s t a g e . t h e c o n t e n t s o f t h i s c a t a l o g a r e a p p l i c a b l e t o t h e p r o d u c t s w h i c h a r e p u r c h a s e d f r o m o u r s a l e s o f ? c e s o r d i s t r i b u - t o r s ( s o c a l l e d ? t a i y o y u d en ? s o f ? c i a l s a l e s c h a n n e l ? ) . i t i s o n l y a p p l i c a b l e t o t h e p r o d u c t s p u r c h a s e d f r o m a n y o f t a i y o y u d en ? s o f ? c i a l s a l e s c h a n n e l . p l e a s e n o t e t h a t t a i y o y u d en c o . , l t d . s h a l l h a v e n o r e s p o n s i b i l i t y fo r a n y c o n t r o v e r s i e s o r d i s p u t e s t h a t m a y o c c u r i n c o n n e c t i o n w i t h a t h i r d p a r t y ' s i n t e l l e c tu a l p r o p e r t y r i g h t s a n d o t h e r r e l a t e d r i g h t s a r i s i n g f r o m y o u r u s a g e o f p r o d u c t s i n t h i s c a t a l o g . t a i y o y u d en c o . , l t d . g r a n t s n o l i c e n s e fo r s u c h r i g h t s . c a u t i o n fo r e x p o r t c e r t a i n i t e m s i n t h i s c a t a l o g m a y r e q u i r e s p e c i ? c p r o c e d u r e s fo r e x p o r t a c c o r d i n g t o ? f o r e i g n e x c h a n g e a n d f o r - e i g n t r a d e c o n t r o l l a w ? o f j a p a n , ? u . s . e x p o r t a d m i n i s t r a t i o n r e g u l a t i o n s ? , a n d o t h e r a p p l i c a b l e r e g u l a t i o n s . s h o u l d y o u h a v e a n y q u e s t i o n o r i n q u i r y o n t h i s m a t t e r , p l e a s e c o n t a c t o u r s a l e s s t a f f .
4 c_mlcc_e-e02r02 mu ltilayer c er amic c ap ac ito r s parts number j m k 3 1 6 b j 1 0 6 m l t blank space ? ? rated voltage code rated voltagevdc p 2.5 a 4 j 6.3 l 10 e 16 t 25 g 35 u 50 h 100 q 250 s 630 series name code series name m multilayer ceramic capacitor v multilayer ceramic capacitor for high frequency w lw reverse type multilayer capacitor end termination code end termination k plated s cu internal electrodes dimensionlw type dimensions lwmm eiainch 042 0.4 0.2 01005 063 0.6 0.3 0201 105 1.0 0.5 0402 0.52 1.0 0204 107 1.6 0.8 0603 0.8 1.6 0306 212 2.0 1.25 0805 1.25 2.0 0508 316 3.2 1.6 1206 325 3.2 2.5 1210 432 4.5 3.2 1812 note : lw reverse typewk only dimension tolerance code type lmm wmm tmm all standard standard standard a 063 0.60.05 0.30 .05 0.30.05 105 1.00.10 0.50 .10 0.50.10 107 1.60.15/0.05 0.80.15/0.05 0.80.15/0.05 212 2.00.15/0.05 1.250.15/0.05 0.450.05 0.850.10 1.250.15/0.05 316 3.20.20 1.60.20 0.850.10 1.60.20 325 3.20.30 2.5 0.30 2.50.30 b 105 1.00.15/0.05 0.50.15/0.05 0.50.15/0.05 107 1.60.20/0 0.80.20/0 0.450.05 0.80.20/0 212 2.00.20/0 1.250.20/0 0.850.10 1.250.20/0 316 3.20.30 1.6 0.30 1.60.30 c 105 1.00.20/0 0.50.20/0 0.50.20/0 note: p.6 standard external dimensions = blank space temperature characteristics code high dielectric typeexcluding super low distortion multilayer ceramic capacitorcfcap tm code applicable standard temperature range? ref. temp.? capacitance change capacitance tolerance tolerance code bj jis b 25 85 20 10 10 k 20 m eia x5r 55 85 25 15 10 k 20 m b7 eia x7r 55125 25 15 10 k 20 m c6 eia x6s 55105 25 22 10 k 20 m c7 eia x7s 55125 25 22 10 k 20 m ld() eia x5r 55 85 25 15 10 k 20 m f jis f 25 85 20 30/80 80/20 z eia y5v 30 85 25 22/82 80/20 z note : .ld low distortion high value multilayer ceramic capaci tor = blank spa ce multilayer ceramic capacitors reflow wave ? this catalog contains the typical specifcation only due to the limitation of space. when you consider the purchase of our products, please check our specifcation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) . ceramic capacitors
5 c_mlcc_e-e02r01 temperature compensating type code applicable standard temperature range? ref. temp.? capacitance change capacitance tolerance tolerance code cg eia c0g 55125 25 060ppm/ 0.1pf b 0.25pf c 0.5pf d 1pf f 5 j ch jis ch 55125 20 060ppm/ 0.1pf b 0.25pf c 0.5pf d eia c0h 25 1pf f 5 j 10 k cj jis cj 55125 20 0120ppm/ 0.25pf c eia c0j 25 ck jis ck 55125 20 0250ppm/ 0.25pf c eia c0j 25 uj jis uj 55125 20 750120ppm/ 0.25pf c eia u2j 25 0.5pf d 5 j uk jis uk 55125 20 750250ppm/ 0.5pf c eia u2k 55125 25 sl jis sl 55125 20 +3501000ppm/ 5 j series code super low distortion multilayer ceramic capacitorcfcap tm only code series code sd standard nominal capacitance code example nominal capacitance 0r5 0.5pf 010 1pf 100 10pf 101 100pf 102 1,000pf 103 10,000pf 104 0.1f 105 1.0f 106 10f 107 100f note : rdecimal point capacitance tolerance code capacitance tolerance b 0.1pf c 0.25pf d 0.5pf f 1pf g 2 j 5 k 10 m 20 z 80/20 thickness code thicknessmm c 0.2 d p 0.3 t k 0.45 v 0.5 w a 0.8 d 0.85(212type or more) f 1.15 g 1.25 l 1.6 n 1.9 y 2.0 max m 2.5 special code code special code standard ?packaging code packaging f 178mm taping 2mm pitch t 178mm taping 4mm pitch p 178mm taping 4mm pitch, 1000 pcs/reel 325 typethickness code m w 178mm taping1mm pitch042type only ?internal code code internal code standard ? this catalog contains the typical specifcation only due to the limitation of space. when you consider the purchase of our products, please check our specifcation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) . ceramic capacitors
6 c_mlcc_e-e02r01 standard external dimensions lw reverse type type( eia ) dimension [mm] t *1 e mk04201005 0.40.02 0.20.02 0.20.02 c 0.10.03 d vs04201005 0.40.02 0.20. 02 0.20.02 c 0.10.03 mk0630201 0.60.03 0.30.03 0.30.03 p 0.150.05 t mk1050402 1.00.05 0.50.05 0.20.02 c 0.250.10 0.30.03 p 0.50.05 v vk1050402 1.00.05 0.50.0 5 0.50.05 w 0.250.10 wk1050204 0.520.05 1.00. 05 0.30.05 p 0.180.08 mk1070603 1.60.10 0.80.10 0.450.05 k 0.350.25 0.80.10 a wk1070306 0.80.10 1.60 .10 0.50.05 0.250.15 mk2120805 2.00.10 1.250.10 0.450.05 k 0.50.25 0.850.10 d 1.250.10 g wk2120508 1.250.15 2.00. 15 0.850.1 0.30.2 mk3161206 3.20.15 1.60.15 0.850.10 d 0.5+0.35/-0.25 1.150.10 1.250.10 g 1.60.20 l mk3251210 3.20.30 2.50.20 0.850.10 d 0.60.3 1.150.10 f 1.90.20 n 1.9+0.1/-0.2 y 2.50.20 m mk4321812 4.50.40 3.20.30 2.50.20 m 0.90.6 note : . lw reverse type, *1.thickness code standard quantity type eiainch dimension standard quantitypcs ? code paper tape embossed tape 042 01005 0.2 c 40000 d 063 0201 0.3 p 15000 t 105 0402 0.2 c 20000 0.3 p 15000 0.5 v 10000 w 0204 0.30 p 107 0603 0.45 k 4000 0.8 a 0306 0.50 v 4000 212 0805 0.45 k 4000 0.85 d 1.25 g 3000 0508 0.85 d 4000 316 1206 0.85 d 4000 1.15 f 3000 1.25 g 1.6 l 2000 325 1210 0.85 d 2000 1.15 f 1.9 n 2.0 max y 2.5 m 500t1000p 432 1812 2.5 m 500 note : .lw reverse typewk e ? this catalog contains the typical specifcation only due to the limitation of space. when you consider the purchase of our products, please check our specifcation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) . ceramic capacitors
22 parts number htlt rated voltage x umk105 ch101jv-f ch c0h 100 p 5 1000 200 0.50.05 r umk105 ch121jv-f ch c0h 120 p 5 1000 200 0.50.05 r umk105 ch151jv-f ch c0h 150 p 5 1000 200 0.50.05 r umk105 ch181jv-f ch c0h 180 p 5 1000 200 0.50.05 r umk105 ch221jv-f ch c0h 220 p 5 1000 200 0.50.05 r umk105 ch271jv-f ch c0h 270 p 5 1000 200 0.50.05 r umk105 ch331jv-f ch c0h 330 p 5 1000 200 0.50.05 r umk105 ch361jv-f ch c0h 360 p 5 1000 200 0.50.05 r umk105 ch391jv-f ch c0h 390 p 5 1000 200 0.50.05 r umk105 ch431jv-f ch c0h 430 p 5 1000 200 0.50.05 r umk105 ch471jv-f ch c0h 470 p 5 1000 200 0.50.05 r umk105 ch511jv-f ch c0h 510 p 5 1000 200 0.50.05 r umk105 ch561jv-f ch c0h 560 p 5 1000 200 0.50.05 r umk105 ch621jv-f ch c0h 620 p 5 1000 200 0.50.05 r umk105 ch681jv-f ch c0h 680 p 5 1000 200 0.50.05 r umk105 ch751jv-f ch c0h 750 p 5 1000 200 0.50.05 r umk105 ch821jv-f ch c0h 820 p 5 1000 200 0.50.05 r umk105 ch102jv-f ch c0h 1000 p 5 1000 200 0.50.05 r temperature characteristic u : u/u20.5mm thicknessv htlt rated voltage x umk105 uk0r5cv-f uk u2k 0.5 p 0.25pf 410 200 0.50.05 r umk105 uk010cv-f uk u2k 1 p 0.25pf 420 200 0.50.05 r umk105 uk1r5cv-f uk u2k 1.5 p 0.25pf 430 200 0.50.05 r umk105 uk020cv-f uk u2k 2 p 0.25pf 440 200 0.50.05 r umk105 uk030cv-f uk u2k 3 p 0.25pf 460 200 0.50.05 r umk105 uj040cv-f uj u2j 4 p 0.25pf 480 200 0.50.05 r umk105 uj050cv-f uj u2j 5 p 0.25pf 500 200 0.50.05 r umk105 uj060dv-f uj u2j 6 p 0.5pf 520 200 0.50.05 r umk105 uj070dv-f uj u2j 7 p 0.5pf 540 200 0.50.05 r umk105 uj080dv-f uj u2j 8 p 0.5pf 560 200 0.50.05 r umk105 uj090dv-f uj u2j 9 p 0.5pf 580 200 0.50.05 r umk105 uj100dv-f uj u2j 10 p 0.5pf 600 200 0.50.05 r umk105 uj120jv-f uj u2j 12 p 5 640 200 0.50.05 r umk105 uj150jv-f uj u2j 15 p 5 700 200 0.50.05 r umk105 uj180jv-f uj u2j 18 p 5 760 200 0.50.05 r umk105 uj220jv-f uj u2j 22 p 5 840 200 0.50.05 r umk105 uj270jv-f uj u2j 27 p 5 940 200 0.50.05 r umk105 uj330jv-f uj u2j 33 p 5 1000 200 0.50.05 r umk105 uj390jv-f uj u2j 39 p 5 1000 200 0.50.05 r umk105 uj470jv-f uj u2j 47 p 5 1000 200 0.50.05 r umk105 uj560jv-f uj u2j 56 p 5 1000 200 0.50.05 r umk105 uj680jv-f uj u2j 68 p 5 1000 200 0.50.05 r umk105 uj820jv-f uj u2j 82 p 5 1000 200 0.50.05 r umk105 uj101jv-f uj u2j 100 p 5 1000 200 0.50.05 r umk105 uj121jv-f uj u2j 120 p 5 1000 200 0.50.05 r umk105 uj151jv-f uj u2j 150 p 5 1000 200 0.50.05 r umk105 uj181jv-f uj u2j 180 p 5 1000 200 0.50.05 r umk105 uj221jv-f uj u2j 220 p 5 1000 200 0.50.05 r umk105 uj271jv-f uj u2j 270 p 5 1000 200 0.50.05 r umk105 uj331jv-f uj u2j 330 p 5 1000 200 0.50.05 r temperature characteristic sl0.5mm thicknessv htlt rated voltage x umk105 sl121jv-f sl 120 p 5 1000 200 0.50.05 r umk105 sl151jv-f sl 150 p 5 1000 200 0.50.05 r umk105 sl181jv-f sl 180 p 5 1000 200 0.50.05 r umk105 sl221jv-f sl 220 p 5 1000 200 0.50.05 r umk105 sl271jv-f sl 270 p 5 1000 200 0.50.05 r umk105 sl331jv-f sl 330 p 5 1000 200 0.50.05 r m u l t i l a y e r c e r a m i c c a p a c i t o r s f o r h i g h f r e q u e n c y a p p l i c a t i o n s ( 1 g h z + ) 042type temperature characteristic ch : ch/c0h0.2mm thicknessc htlt rated voltage x tvs042 ch0r2[]c-w ch c0h 0.2 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r3[]c-w ch c0h 0.3 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r4[]c-w ch c0h 0.4 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r5[]c-w ch c0h 0.5 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r6[]c-w ch c0h 0.6 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r7[]c-w ch c0h 0.7 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 chr75[]c-w ch c0h 0.75 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r8[]c-w ch c0h 0.8 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch0r9[]c-w ch c0h 0.9 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch010[]c-w ch c0h 1 p 0.1pf, 0.25pf 300 200 0.20.02 r tvs042 ch1r1[]c-w ch c0h 1.1 p 0.1pf, 0.25pf 280 200 0.20.02 r tvs042 ch1r2[]c-w ch c0h 1.2 p 0.1pf, 0.25pf 270 200 0.20.02 r tvs042 ch1r3[]c-w ch c0h 1.3 p 0.1pf, 0.25pf 260 200 0.20.02 r tvs042 ch1r5[]c-w ch c0h 1.5 p 0.1pf, 0.25pf 240 200 0.20.02 r tvs042 ch1r6[]c-w ch c0h 1.6 p 0.1pf, 0.25pf 230 200 0.20.02 r tvs042 ch1r8[]c-w ch c0h 1.8 p 0.1pf, 0.25pf 210 200 0.20.02 r tvs042 ch020[]c-w ch c0h 2 p 0.1pf, 0.25pf 190 200 0.20.02 r tvs042 ch2r2[]c-w ch c0h 2.2 p 0.1pf, 0.25pf 180 200 0.20.02 r tvs042 ch2r4[]c-w ch c0h 2.4 p 0.1pf, 0.25pf 170 200 0.20.02 r soldering r:reflow w:wave thickness *3 [mm] capacitance tolerance [] capacitance tolerance [] q (at 1mhz) min thickness *3 [mm] soldering r:reflow w:wave thickness *3 [mm] thickness *3 [mm] rated voltage [v] capacitance [f] temperature characteristics capacitance [f] part number 1 part number 2 part number 1 q (at 1mhz) min q (at 1mhz) min temperature characteristics temperature characteristics capacitance tolerance [] soldering r:reflow w:wave soldering r:reflow w:wave rated voltage [v] part number 2 capacitance [f] 50 25 part number 1 50 50 rated voltage [v] part number 2 temperature characteristics capacitance [f] capacitance tolerance [] q (at 1ghz) (min) part number 1 part number 2 rated voltage [v] c_mlcc_e-e02r01 ? this catalog contains the typical specifcation only due to the limitation of space. when you consider the purchase of our products, please check our specifcation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) . ceramic capacitors
23 parts number htlt rated voltage x tvs042 ch2r7[]c-w ch c0h 2.7 p 0.1pf, 0.25pf 150 200 0.20.02 r tvs042 ch030[]c-w ch c0h 3 p 0.1pf, 0.25pf 130 200 0.20.02 r tvs042 ch3r3[]c-w ch c0h 3.3 p 0.1pf, 0.25pf 120 200 0.20.02 r tvs042 ch3r6[]c-w ch c0h 3.6 p 0.1pf, 0.25pf 110 200 0.20.02 r tvs042 ch3r9[]c-w ch c0h 3.9 p 0.1pf, 0.25pf 100 200 0.20.02 r tvs042 ch040[]c-w ch c0h 4 p 0.1pf, 0.25pf 90 200 0.20.02 r tvs042 ch4r3[]c-w ch c0h 4.3 p 0.1pf, 0.25pf 85 200 0.20.02 r tvs042 ch4r7[]c-w ch c0h 4.7 p 0.1pf, 0.25pf 85 200 0.20.02 r tvs042 ch050[]c-w ch c0h 5 p 0.1pf, 0.25pf 80 200 0.20.02 r tvs042 ch5r1[]c-w ch c0h 5.1 p 0.25pf, 0.5pf 75 200 0.20.02 r tvs042 ch5r6[]c-w ch c0h 5.6 p 0.25pf, 0.5pf 70 200 0.20.02 r tvs042 ch060[]c-w ch c0h 6 p 0.25pf, 0.5pf 65 200 0.20.02 r tvs042 ch6r2[]c-w ch c0h 6.2 p 0.25pf, 0.5pf 65 200 0.20.02 r tvs042 ch6r8[]c-w ch c0h 6.8 p 0.25pf, 0.5pf 60 200 0.20.02 r tvs042 ch070[]c-w ch c0h 7 p 0.25pf, 0.5pf 60 200 0.20.02 r tvs042 ch7r5[]c-w ch c0h 7.5 p 0.25pf, 0.5pf 55 200 0.20.02 r tvs042 ch080[]c-w ch c0h 8 p 0.25pf, 0.5pf 55 200 0.20.02 r tvs042 ch8r2[]c-w ch c0h 8.2 p 0.25pf, 0.5pf 50 200 0.20.02 r tvs042 ch090[]c-w ch c0h 9 p 0.25pf, 0.5pf 50 200 0.20.02 r tvs042 ch9r1[]c-w ch c0h 9.1 p 0.25pf, 0.5pf 45 200 0.20.02 r tvs042 ch100[]c-w ch c0h 10 p 2%, 5% 45 200 0.20.02 r tvs042 ch110jc-w ch c0h 11 p 5% 40 200 0.20.02 r tvs042 ch120jc-w ch c0h 12 p 5% 40 200 0.20.02 r tvs042 ch130jc-w ch c0h 13 p 5% 40 200 0.20.02 r tvs042 ch150jc-w ch c0h 15 p 5% 40 200 0.20.02 r tvs042 ch160jc-w ch c0h 16 p 5% 40 200 0.20.02 r tvs042 ch180jc-w ch c0h 18 p 5% 40 200 0.20.02 r tvs042 ch220jc-w ch c0h 22 p 5% 30 200 0.20.02 r 105type temperature characteristic ch : ch/c0h0.5mm thicknessw htlt rated voltage x evk105 ch0r3bw-f ch c0h 0.3 p 0.1pf 300 200 0.50.05 r evk105 ch0r4bw-f ch c0h 0.4 p 0.1pf 300 200 0.50.05 r evk105 ch0r5bw-f ch c0h 0.5 p 0.1pf 300 200 0.50.05 r evk105 ch0r6bw-f ch c0h 0.6 p 0.1pf 300 200 0.50.05 r evk105 ch0r7bw-f ch c0h 0.7 p 0.1pf 300 200 0.50.05 r evk105 ch0r8bw-f ch c0h 0.8 p 0.1pf 300 200 0.50.05 r evk105 ch0r9bw-f ch c0h 0.9 p 0.1pf 300 200 0.50.05 r evk105 ch010bw-f ch c0h 1 p 0.1pf 300 200 0.50.05 r evk105 ch1r1bw-f ch c0h 1.1 p 0.1pf 280 200 0.50.05 r evk105 ch1r2bw-f ch c0h 1.2 p 0.1pf 270 200 0.50.05 r evk105 ch1r3bw-f ch c0h 1.3 p 0.1pf 260 200 0.50.05 r evk105 ch1r5bw-f ch c0h 1.5 p 0.1pf 240 200 0.50.05 r evk105 ch1r6bw-f ch c0h 1.6 p 0.1pf 230 200 0.50.05 r evk105 ch1r8bw-f ch c0h 1.8 p 0.1pf 210 200 0.50.05 r evk105 ch020bw-f ch c0h 2 p 0.1pf 190 200 0.50.05 r evk105 ch2r2jw-f ch c0h 2.2 p 5 180 200 0.50.05 r evk105 ch2r4jw-f ch c0h 2.4 p 5 170 200 0.50.05 r evk105 ch2r7jw-f ch c0h 2.7 p 5 150 200 0.50.05 r evk105 ch030jw-f ch c0h 3 p 5 130 200 0.50.05 r evk105 ch3r3jw-f ch c0h 3.3 p 5 120 200 0.50.05 r evk105 ch3r6jw-f ch c0h 3.6 p 5 110 200 0.50.05 r evk105 ch3r9jw-f ch c0h 3.9 p 5 99 200 0.50.05 r evk105 ch4r3jw-f ch c0h 4.3 p 5 84 200 0.50.05 r evk105 ch4r7jw-f ch c0h 4.7 p 5 84 200 0.50.05 r evk105 ch5r1jw-f ch c0h 5.1 p 5 84 200 0.50.05 r temperature characteristic ch : ch/c0h0.5mm thicknessw htlt rated voltage x uvk105 ch0r3bw-f ch c0h 0.3 p 0.1pf 300 200 0.50.05 r uvk105 ch0r4bw-f ch c0h 0.4 p 0.1pf 300 200 0.50.05 r uvk105 ch0r5bw-f ch c0h 0.5 p 0.1pf 300 200 0.50.05 r uvk105 ch0r6bw-f ch c0h 0.6 p 0.1pf 300 200 0.50.05 r uvk105 ch0r7bw-f ch c0h 0.7 p 0.1pf 300 200 0.50.05 r uvk105 ch0r8bw-f ch c0h 0.8 p 0.1pf 300 200 0.50.05 r uvk105 ch0r9bw-f ch c0h 0.9 p 0.1pf 300 200 0.50.05 r uvk105 ch010bw-f ch c0h 1 p 0.1pf 300 200 0.50.05 r uvk105 ch1r1bw-f ch c0h 1.1 p 0.1pf 280 200 0.50.05 r uvk105 ch1r2bw-f ch c0h 1.2 p 0.1pf 270 200 0.50.05 r uvk105 ch1r3bw-f ch c0h 1.3 p 0.1pf 260 200 0.50.05 r uvk105 ch1r5bw-f ch c0h 1.5 p 0.1pf 240 200 0.50.05 r uvk105 ch1r6bw-f ch c0h 1.6 p 0.1pf 230 200 0.50.05 r uvk105 ch1r8bw-f ch c0h 1.8 p 0.1pf 210 200 0.50.05 r uvk105 ch020bw-f ch c0h 2 p 0.1pf 190 200 0.50.05 r uvk105 ch2r2jw-f ch c0h 2.2 p 5 180 200 0.50.05 r uvk105 ch2r4jw-f ch c0h 2.4 p 5 170 200 0.50.05 r uvk105 ch2r7jw-f ch c0h 2.7 p 5 150 200 0.50.05 r uvk105 ch030jw-f ch c0h 3 p 5 130 200 0.50.05 r uvk105 ch3r3jw-f ch c0h 3.3 p 5 120 200 0.50.05 r uvk105 ch3r6jw-f ch c0h 3.6 p 5 110 200 0.50.05 r uvk105 ch3r9jw-f ch c0h 3.9 p 5 99 200 0.50.05 r uvk105 ch4r3jw-f ch c0h 4.3 p 5 84 200 0.50.05 r uvk105 ch4r7jw-f ch c0h 4.7 p 5 84 200 0.50.05 r uvk105 ch5r1jw-f ch c0h 5.1 p 5 84 200 0.50.05 r capacitance [f] soldering r:reflow w:wave 16 thickness *3 [mm] thickness *3 [mm] thickness *3 [mm] part number 1 part number 2 part number 1 rated voltage [v] rated voltage [v] capacitance [f] q (at 1ghz) (min) capacitance tolerance [] capacitance tolerance [] q (at 1ghz) (min) capacitance tolerance [] temperature characteristics 50 soldering r:reflow w:wave q (at 1ghz) (min) soldering r:reflow w:wave temperature characteristics part number 2 25 temperature characteristics capacitance [f] part number 2 rated voltage [v] part number 1 c_mlcc_e-e02r01 ? this catalog contains the typical specifcation only due to the limitation of space. when you consider the purchase of our products, please check our specifcation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) . ceramic capacitors
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_pack_e-e02r01 multilayer ceramic capacitors packaging minimum quantity taped package type(eia) thickness standard quantity [pcs] mm code paper tape embossed tape mk042(01005) 0.2 c, d 40000 vs042(01005) 0.2 c mk063(0201) 0.3 p, t 15000 wk105(0204) 0.3 p 10000 mk105(0402) 0.2 c 20000 0.3 p 15000 0.5 v 10000 vk105(0402) 0.5 w mk107(0603) wk107(0306) mr107(0603) 0.45 k 4000 0.5 v 4000 0.8 a 4000 mk212(0805) wk212(0508) mr212(0805) 0.45 k 0.85 d 125 g 3000 mk316(1206) mr316(1206) 0.85 d 4000 1.15 f 3000 125 g 1.6 l 2000 mk325(1210) mr325(1210) 0.85 d 2000 1.15 f 1.9 n 2.0max. y 2.5 m 500t, 1000p mk432(1812) 2.5 m 500 note : lw reverse type. taping material no bottom tape for pr essed carrier tape card board carrier tape top tape base tape sprocket hole bottom tape chip cavity embossed tape top tape base tape sprocket hole chip cavity chip filled chip
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_pack_e-e02r01 representative taping dimensions paper tape8mm wide pressed carrier tape 2mm pitch type(eia) chip cavity insertion pitch tape thickness t1 mk063(0201) 0.37 0.67 2.00.05 0.45max. 0.42max. wk105(0204) 0.65 1.15 mk105(0402) *1 c 0.4max. 0.3max. mk105(0402) *1 p 0.45max. 0.42max. note *1 thickness, c0.2mm ,p0.3mm. lw reverse type. unitm m punched carrier tape 2mm pitch type(eia) chip cavity insertion pitch tape thickness mk105 (0402) vk105 (0402) 0.65 1.15 2.00.05 0.8max. unitmm punched carrier tape 4mm pitch type(eia) chip cavity insertion pitch tape thickness mk107(0603) wk107(0306) mr107(0603) 1.0 1.8 4.00.1 1.1max. mk212(0805) wk212(0508) 1.65 2.4 1.1max. mk316(1206) 2.0 3.6 notetaping size might be different depending on the size of th e product. lw reverse type. unitmm
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_pack_e-e02r01 embossed tape4mm wide type(eia) chip cavity insertion pitch tape thickness k t mk042(01005) 0.23 0.43 1.00.02 0.5max. 0.25max. vs042(01005) unitmm embossed tape8mm wide type(eia) chip cavity insertion pitch tape thickness k t wk107(0306) 1.0 1.8 4.00.1 1.3max. 0.250.1 mk212(0805) mr212(0805) 1.65 2.4 3.4max. 0.6max. mk316(1206) mr316(1206) 2.0 3.6 mk325(1210) mr325(1210) 2.8 3.6 note lw reverse type. unitmm embossed tape12mm wide type(eia) chip cavity insertion pitch tape thickness k t mk432(1812) 3.7 4.9 8.00.1 4.0max. 0.6max. unitmm
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_pack_e-e02r01 trailer and leader blank portion chip cavity blank portion leader 160mm or more (6.3inches or more) direction of tape feed 100mm or more (3.94inches or more) 400mm or more (15.7inches or more) reel size e c d r b t a w a b c d e r 1782.0 50min. 13.00. 2 21.00.8 2.00.5 1.0 t w 4mm wide tape 1.5max. 51.0 8mm wide tape 2.5max. 101.5 12mm wide tape 2.5max. 141.5 unitmm top tape strength the top tape requires a peel-off force of 0.1 to 0.7n in the di rection of the arrow as illustrated below. 020 top tape base tape pull direction bulk cassette the exchange of individual specification is necessary. please contact taiyo yuden sales channels. shutter 360/0.2 120.1 slider connecting port 1100.7 31.50.2/0 360/0.2 12.00.1 8.80.1 6.80.1 1.00/0.1 2.00/0.1 1.50.1/0 unitmm
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 super low distortion multilayer ceramic capacito rs , medium-hig h voltage multilayer ceramic capacitors and high reliability application mult ilayer ceramic capacitors are noted separately. multilayer ceramic capacitors reliability data 1.operating temperature range specified value temperature compensatingclass1 standard 55 to 125 high frequency type high permittivity class2 specification temperature range bj b 25 to 85 x5r 55 to 85 b7 x7r 55 to 125 c6 x6s 55 to 105 c7 x7s 55 to 125 ld() x5r 55 to 85 f f 25 to 85 y5v 30 to 85 note: ld low distortion high value multilayer ceramic capacito r 2. storage conditions specified value temperature compensatingclass1 standard 55 to 125 high frequency type high permittivity class2 specification temperature range bj b 25 to 85 x5r 55 to 85 b7 x7r 55 to 125 c6 x6s 55 to 105 c7 x7s 55 to 125 ld() x5r 55 to 85 f f 25 to 85 y5v 30 to 85 note: ld low distortion high value multilayer ceramic capacito r 3. rated voltage specified value temperature compensatingclass1 standard 50vdc, 25vdc, 16vdc high frequency type 50vdc, 25vdc, 16vdc high permittivity class2 50vdc , 35vdc, 25vdc, 16vdc, 10vdc, 6 .3vdc, 4vdc, 2.5vdc 4. withstanding voltage between terminals specified value temperature compensatingclass1 standard no breakdown or damage high frequency type high permittivity class2 test methods and remarks class 1 class 2 applied voltage rated voltage3 rated voltage2.5 duration 1 to 5 sec. charge/discharge current 50ma max. 5. insulation resistance specified value temperature compensatingclass1 standard 10000 m min. high frequency type high permittivity class2 note 1 cQ0.047f : 10000 m min. c0.047f : 500m?f test methods and remarks applied voltage : rated voltage duration : 605 sec. charge/discharge current : 50ma max.
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 6. capacitance tolerance specified value temperature compensatingclass1 standard c u sl 0.2pfQcQ5pf : 0.25pf 0.2pfQcQ10pf : 0.5pf c10pf : 5% or 10% high frequency type ch 0.2pfQcQ2pf : 0.1pf c2pf : 5% high permittivity class2 bj, b7, c6, c7, ld() : 10% or 20%, f : 80/20% note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 class 2 standard high frequency type cQ10f c10f preconditioning none thermal treatment at 150 for 1hr note 2 measuring frequency 1hz10% 1khz10% 12010hz measuring voltage note 0.5 to 5vrms 10.2vrms 0.50.1vrms bias application none 7. q or dissipation factor specified value temperature compensatingclass1 standard c30pf : qR40020c cR30pf : qR1000 cnominal capacita nce high frequency type refer to detailed specification high permittivity class2 note 1 bj, b7, c6, c72.5% max., f 7% max. test methods and remarks class 1 class 2 standard high frequency type cQ10f c10f preconditioning none thermal treatment at 150 for 1hr note 2 measuring frequency 1hz10% 1ghz 1hz10% 12010hz measuring voltage note 1 0.5 t o 5vrms 10.2vrms 0.50.1vrms bias application none high frequency type measuring equipment : hp4291a measuring jig : hp16192a 8. temperature characteristic without voltage application specified value temperature compensatingclass1 standard temperature characteristic ppm/ tolerance ppm/ c : 0 cg,ch, cj, ck g : 30 h : 60 j : 120 k : 250 u : 750 uj, uk sl : 350 to 1000 high frequency type temperature characteristic ppm/ tolerance ppm/ c : 0 ch h : 60 high permittivity class2 specification capacitance change reference temperature temperature range bj b 10% 20 25 to 85 x5r 15% 25 55 to 85 b7 x7r 15% 25 55 to 125 c6 x6s 22% 25 55 to 105 c7 x7s 22% 25 55 to 125 ld() x5r 15% 25 55 to 85 f f 30/80% 20 25 to 85 y5v 22/82% 25 30 to 85 note : ld low distortion high value multilayer ceramic capaci tor test methods and remarks class 1 capacitance at 20 and 85 shall be measured in thermal equilib rium, and the temperature characteristic shall be calculated fr om the following equation. c 85 c 20 10 6 ppm/ c 20 t t65 class 2 capacitance at each step shall be measured in thermal equilibri um, and the temperature characteristic shall be calculated from the following equation. step bf x5rx7rx6sx7sy5v 1 minimum operating temperature 2 20 25 3 maximum operating temperature
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 cc 2 100% c 2 c capacitance in step 1 or step 3 c2 capacitance in step 2 9. deflection specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 5% or 0.5 pf, whichever is larger . high frequency type appearance : no abnormality capacitance change : within0.5 pf high permittivity class2 appearance : no abnormality capacitance change : within 12.5%bj, b7, c6, c7,ld() within 30%f note: ld low distortion high value multilayer ceramic capacito r test methods and remarks multilayer ceramic capacitors 042, 063, 105 type the other types board glass epoxy-resin substrate thickness 0.8mm 1.6mm warp 1mm duration 10 sec. 105 type thickness, c 0.2mm ,p 0.3mm. capacitance measurement shall be conducted with the board bent 10. body strength specified value temperature compensatingclass1 standard high frequency type no m echanical damage. high permittivity class2 test methods and remarks high frequency type applied force : 5n duration : 10 sec. 11. adhesive strength of terminal electrodes specified value temperature compensatingclass1 standard no terminal separation or its indication. high frequency type high permittivity class2 test methods and remarks multilayer ceramic capacitors 042, 063 type 105 type or more applied force 2n 5n duration 305 sec. 12. solderability specified value temperature compensatingclass1 standard at least 95% of terminal electrode is covered by new solder. high frequency type high permittivity class2 test methods and remarks eutectic solder lead-free solder solder type h60a or h63a sn-3.0ag-0.5cu solder temperature 2305 2453 duration 41 sec.
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 13. resistance to soldering specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 2. 5% or 0.25pf, whichever is larg er. q : initial value insulation resistance : initial value withstanding voltage between terminals : no abnormality high frequency type appearance : no abnormality capacitance change : within 2.5% q : initial value insulation resistance : initial value withstanding voltage between terminals : no abnormality high permittivity class2 note 1 appearance : no abnormality capacitance change : within 7.5%bj, b7, c6, c7, ld() within 20%f dissipation factor : initial value insulation resistance : initial value withstanding voltage between terminals: no abnormality note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 042, 063 type 105 type preconditioning none preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min. 150 to 200, 2 to 5 min. solder temp. 2705 duration 30.5 sec. recovery 6 to 24 hrs standard condition note 5 class 2 042063 type 105, 107, 212 type 316, 325 type preconditioning thermal treatment at 150 for 1 hr note 2 preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min. 150 to 200, 2 to 5 min. 80 to 100, 5 to 10 min. 150 to 200, 5 to 10 min. solder temp. 2705 duration 30.5 sec. recovery 242 hrs standard condition note 5 14. temperature cycle (thermal shock specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 2. 5% or 0.25pf, whichever is larg er. q : initial value insulation resistance : initial value withstanding voltage between terminals : no abnormality high frequency type appearance : no abnormality capacitance change : within 0.25pf q : initial value insulation resistance : initial value withstanding voltage between terminals : no abnormality high permittivity class2 note 1 appearance : no abnormality capacitance change : within 7. 5% bj, b7, c6, c7, ld() within 20% f dissipation factor : initial value insulation resistance : initial value withstanding voltage between terminals : no abnormality note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 class 2 preconditioning none thermal treatment at 150 for 1 hr note 2 1 cycle step temperature timemin. 1 minimum operating temperature 303 2 normal temperature 2 to 3 3 maximum operating temperature 303 4 normal temperature 2 to 3 number of cycles 5 times recovery 6 to 24 hrs standard condition note 5 242 hrs stan dard condition note 5
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 15. humidity steady state specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 5% or 0.5pf, whichever is larger. q : c10pf : qR20010c 10Qc30pf : qR2752.5c cR30pf:qR350cnominal capacitance insulation resistance : 1000 m min. high frequency type appearance : no abnormality capacitance change : within 0.5pf, insulation resistance : 1000 m min. high permittivity class2 note 1 appearance : no abnormality capacitance change : within 12.5% bj, b7, c6, c7, ld() within 30% f dissipation factor : 5.0% max.bj, b7, c6, c7, ld() 11.0% max.f insulation resistance : 50 m?f or 1000 m whichever is smaller . note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 class 2 standard high frequency type all items preconditioning none thermal treatment at 150 for 1 hr note 2 temperature 402 602 402 humidity 90 to 95%rh 90 to 95%rh duration 50024/0 hrs 50024/0 hrs recovery 6 to 24 hrs standard condition note 5 242 hrs stan dard condition note 5 16. humidity loading specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 7. 5% or 0.75pf, whichever is larg er. q : c30pfqR10010c/3 cR30pfqR200 cnominal capacitance insulation resistance : 500 m min. high frequency type appearance : no abnormality capacitance change : cQ2pfwithin 0.4 pf c2pfwithin 0.75 pf cnominal capacita nce insulation resistance : 500 m min. high permittivity class2 note 1 appearance : no abnormality capacitance change : within 12.5% bj, b7, c6, c7, ld() within 30% f dissipation factor : 5.0% ma x. bj, b7, c6, c7, ld() 11.0% max. f insulation resistance : 25 m?f or 500 m, whichever is smaller . note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 class 2 standard high frequency type all items preconditioning none voltage treatment rated voltage are applied for 1 hour at 40 note 3 temperature 402 602 402 humidity 90 to 95%rh 90 to 95%rh duration 50024/0 hrs 50024/0 hrs applied voltage rated voltage rated voltage charge/discharge current 50ma max. 50ma max. recovery 6 to 24 hrs standard condition note 5 242 hrsstan dard condition note 5
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_reli_e-e02r01 17. high temperature loading specified value temperature compensatingclass1 standard appearance : no abnormality capacitance change : within 3% or 0.3pf, whichever is larger. q : c10pf qR20010c 10Qc30pfqR2752.5c cR30pf qR350cnominal capacitance insulation resistance : 1000 m min. high frequency type appearance : no abnormality capacitance change : within 3% or 0.3pf, whichever is larger. insulation resistance : 1000 m min. high permittivity class2 note 1 appearance : no abnormality capacitance change : within 12.5% bj, b7, c6, c7, ld() within 30% f dissipation factor : 5.0% max.bj, b7, c6, c7, ld() 11.0% max.f insulation resistance : 50 m?f or 1000 m, whichever is smalle r. note: ld low distortion high value multilayer ceramic capacito r test methods and remarks class 1 class 2 standard high frequency type bj, ld(), f c6 b7, c7 preconditioning none voltage treatmenttwice the rated voltage shall be applied for 1 hour at 85, 105 or 125 note 3, 4 temperature maximum operating temperature maximum operating te mperature duration 100048/0 hrs 100048/0 hrs applied voltage rated voltage2 rated voltage2 note 4 charge/discharge current 50ma max. 50ma max. recovery 6 to 24hr standard condition note 5 242 hrs stand ard condition note 5 note: ld low distortion high value multilayer ceramic capacito r note 1 the figures indicate typic al specifications. please refe r to individual specifications in detail. note 2 thermal treatment : initial value shall be measured afte r test sample is heat-treated at 1500/10 for an hour and kep t at room temperature for 242hours. note 3 voltage treatment : initial value shall be measured afte r test sample is voltage-treated for an hour at both the temper ature and voltage specified in the test conditions, and kept at room temperature for 242 hours. note 4 150% of rated voltage is applicable to some items. pleas e refer to their specifications for further information. note 5 standard condition: temperature: 5 to 35, relative humi dity: 45 to 85 % rh, air pressure: 86 to 106kpa when there are questions concerning measurement results, in order to provide correlation dat a, the test shall be conducted under the following condition. temperature: 202, relative humidity: 60 to 70 % rh, air press ure: 86 to 106kpa unless otherwise specified, all the tests are conducted under the "standard condition".
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_prec_e-e02r01 high reliability application mult ilayer ceramic capacitors are noted separately. precautions on the use of multilayer ceramic capacitors precautions 1. circuit design precautions verification of operating environment, electrical rating and p erformance 1. a malfunction of equipment in fields such as medical, aerosp ace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. therefore, any capacitors to be used in such equipment may requ ire higher safety and reliability, and shall be clearly differe ntiated from them used in general p urpose applications. operating voltage verifi cation of rated voltage 1. the operating voltage for capacitors must always be their ra ted voltage or less. if an ac voltage is loaded on a dc voltage, the sum of the two peak voltages shall be the rated voltage or less. for a circuit where an ac or a p ulse voltage may be used, the s um of their peak voltages shall also be the rated voltage or le ss. 2. even if an applied voltage is the rated voltage or less reli ability of capacitors may be det eriorated in case that either a high frequency ac voltage or a pulse voltage having rapid rise time is used in a circuit. 2. pcb design precautions pattern configurations d esign of land-patterns 1. when capacitors are mounted on pcbs, the amount of solder us ed size of fillet can directly affect the capacitor performan ce. therefore, the following items must be carefully considered in the design of land patterns: 1excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. therefore, please consider appropriate land-patterns for proper amount of solder. 2when more than one component are jointly soldered onto the s ame land, each component's soldering point shall be separated b y solder-resist. pattern configurations capacitor layout on pcbs after capacitors are mounted on boards, they can be subjected t o mechanical stresses in subsequent manufacturing processes pc b cutting, board inspection, mounting of additional parts, assemb ly into the chassis, wave soldering of the boards, etc.. for t his reason, land pattern configurations and positions of capacitors shall be car efully considered to minimize stresses. technical considerations pattern configurations d esign of land-patterns the following diagrams and tables show some examples of recomme nded land patterns to prevent excessive solder amounts. 1recommended land dimensions for typical chip capacitors multilayer ceramic capacitors : recommended land dimensions unit: mm wave-soldering type 107 212 316 325 size l 1.6 2.0 3.2 3.2 w 0.8 1.25 1.6 2.5 a 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 b 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 c 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 land patterns for pcbs c b a b chip capacitor land pattern solder-resist l w chip capacitor reflow-soldering type 042 063 105 107 212 316 325 432 size l 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5 w 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2 a 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1. 8 to 2.5 1.8 to 2.5 2.5 to 3.5 b 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1. 0 to 1.5 1.0 to 1.5 1.5 to 1.8 c 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1. 2 to 2.0 1.8 to 3.2 2.3 to 3.5 noterecommended land size might be different according to the allowance of the size of the product. lwdc: recommended land dimensions for reflow-soldering unit: mm type 105 107 212 size l 0.52 0.8 1.25 w 1.0 1.6 2.0 a 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 b 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 c 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 l w lwdc
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_prec_e-e02r01 2examples of good and bad solder application item not recommended recommended mixed mounting of smd and leaded components lead wire of component solder-resist component placement close to the chassis chassis solder (for grounding) electrode pattern solder-resist hand-soldering of leaded components near mounted components soldering iron lead wire of component solder-resist horizontal component placement solder-resist pattern configurations capacitor layout on pcbs 1-1. the following is examples of good and bad capacitor layout s ; capacitors shall be located to minimize any possible mech anical stresses from board warp or deflection. items not recommended recommended deflection of board place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. the amount of mechanical st resses given will vary dependin g on capacitor layout. please refer to diagram below. e d c a b slit magnitude of stress abcde perforation 1-3. when pcb is split, the amount of mechanical stress on the capacitors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: pus h-back, slit, v-grooving, and perforation. thus, please conside r the pcb, split methods as well as chip location. 3. mounting precautions adjustment of mounting machine 1. when capacitors are mounted on pcb, excessive impact load sh all not be imposed on them. 2. maintenance and inspection of mounting machines shall be con ducted periodically. selection of adhesives 1. when chips are attached on pcbs with adhesives prior to sold ering, it may cause capacitor characteristics degradation unles s the following factors are appropriately checked : size of land patt erns, type of adhesive, amount applied, hardening temperature a nd hardening period. therefore, please contact us for further info rmation.
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_prec_e-e02r01 technical considerations adjustment of mounting machine 1. when the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. to avoid this, the following points shall be considerable. 1the bottom dead center of the pick-up nozzle shall be adjust ed to the surface level of pcb without the board deflection. 2the pressure of nozzle shall be adjusted between 1 and 3 n s tatic loads. 3to reduce the amount of deflection of the board caused by im pact of the pick-up nozzle, supporting pins or back-up pins sh all be used on the other side of the pcb. the following diagrams show some typical examples of good and bad pick-up nozzle placement: item improper method proper method single-sided mounting chipping or cracking supporting pins or back-up pins double-sided mounting chipping or cracking supporting pins or back-up pins 2. as the alignment pin is worn out, adjustment of the nozzle h eight can cause chipping or cracking of capacitors because of m echanical impact on the capacitors. to avoid this, the monitoring of the width between the alignmen t pins in the stopped position, maintenance, check and replacem ent of the pin shall be conducted periodically. selection of adhesives some adhesives may cause ir deterioration. the different shrink age percentage of between the adhesive and the capacitors may r esult in stresses on the capacitors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect components. therefore, the following precautions shall be noted in the applicatio n of adhesives. 1required adhesive characteristics a. the adhesive shall be strong enough to hold parts on the boa rd during the mounting & solder process. b. the adhesive shall have sufficient strength at high temperat ures. c. the adhesive shall have good coating and thickness consisten cy. d. the adhesive shall be used during its prescribed shelf life. e. the adhesive shall harden rapidly. f. the adhesive shall have corrosion resistance. g. the adhesive shall have excellent insulation characteristics . h. the adhesive shall have no emission of toxic gasses and no e ffect on the human body. 2the recommended amount of adhesives is as follows; recommended condition figure 212/316 case sizes as examples a 0.3mm min b 100 to 120m c adhesives shall not contact land amount adhesive aa b after capacitor are bonded c c 4. soldering precautions selection of flux since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; 1flux used shall be less than or equal to 0.1 wt% in cl equi valent of halogenated content. flux having a strong acidity co ntent shall not be applied. 2when shall capacitors are soldered on boards, the amount of flux applied shall be contro lled at the optimum level. 3when water-soluble flux is used, special care shall be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. shall be set in accor dance with their recommended conditions. sn-zn solder paste can adversely affect mlcc reliability. please contact us prior to usage of sn-zn solder. technical considerations selection of flux 1-1. when too much halogenated substancechlorine, etc. conten t is used to activate flux, or highly acidic flux is used, it m ay lead to corrosion of terminal electrodes or degradation of insulation r esistance on the surfaces of the capacitors. 1-2. flux is used to increase sol derability in wave soldering. however if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the so lderability. to minimize the amo unt of flux applied, it is recommended to use a flux-bubbling s ystem. 1-3. since the residue of water-soluble flux is easily dissolve d in moisture in the air, the residues on the surfaces of capac itors in high humidity conditions may cause a degradation of insulation resis tance and reliability of the capacitors. therefore, the cleanin g methods and the capability of the machines used shall also be c onsidered carefully when water-soluble flux is used.
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_prec_e-e02r01 soldering ? ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ? therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive t hermal shock. ? preheating : capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder sh all be within 100 to 130. ? cooling : the temperature difference between the capacitors a nd cleaning process shall not be greater than 100. reflow soldering recommended conditions for eutectic soldering preheating 230 within 10sec. slow cooling 60sec. min. 60sec min. 300 200 100 0 temperature recommended condition for pb-free soldering peak 260 max. within 10sec. slow cooling heating above 230 40sec. max. 300 200 100 0 temperature preheating150 60sec. min. caution the ideal condition is to have solder massfilletcontrolled t o 1/2 to 1/3 of the thickness of a capacitor. because excessive dwell times can adversely affect solderabili ty, soldering duration shall be kept as close to recommended times as possible. 1/2t1/3t pc board solder capacitor t wave soldering recommended conditions for eutectic soldering 230250 within 3sec. slow cooling preheating 120sec. min. 300 200 100 0 temperature recommended condition for pb-free soldering peak 260 max. within 10sec. slow cooling 120sec. min. 300 200 100 0 temperature preheating 150 caution wave soldering must not be applie d to capacitors designated as for reflow soldering only. hand soldering recommended conditions for eutectic soldering 230280 within 3sec. slow cooling preheating 60sec. min. 400 200 100 0 temperature 300 recommended condition for pb-free soldering peak 350 max. within 3sec. slow cooling St 400 200 100 0 temperature preheating 150 min. 60sec. min. 300 St 316type or less StQ150 peak 280 max. within 3sec. slow cooling St 400 200 100 0 ?? preheating 150 min. 60sec. min. 300 St 325type or more StQ130 caution use a 50w soldering iron with a maximum tip diameter of 1.0 mm . the soldering iron shall not directly touch capacitors. 5. cleaning precautions cleaning conditions 1. when pcbs are cleaned after capacitors mounting, please sele ct the appropriate cleaning solution in accordance with the int ended use of the cleaning. e.g. to remove soldering flux or other materi als from the production process. 2. cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. technical considerations 1. the use of inappropriate cleaning solutions can cause foreig n substances such as flux residue to adhere to capacitors or de teriorate their outer coating, resulting in a degradation of the capacito r's electrical properties esp ecially insulation resistance. 2. inappropriate cleaning condi tions insufficient or excessive cleaning may adversely affect the performance of the cap acitors. in the case of ultrasonic cleaning, too much power output can c ause excessive vibration of pcbs which may lead to th e cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. therefore, the following condit ions shall be carefully checked; ultrasonic output : 20 w/? or less ultrasonic frequency : 40 khz or less ultrasonic washing period : 5 min. or less
? this catalog contains the typica l specification only due to the limitation of space. when you co nsider the pur chase of our pro ducts, please check o ur specification. for details of each pr oduct (characteristics graph, reliability information, precautions for us e, and so on), see our web site (http://www.ty-top.com/) . c_mlcc_prec_e-e02r01 6. resin coating and mold precautions 1. with some type of resins, decomposition gas or chemical reac tion vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the det erioration of the capacitor's performance. 2. when a resin's hardening temperature is higher than capacito r's operating temperature, the stresses generated by the excess ive heat may lead to damage or destruction of capacitors. the use of such resins, molding materials etc. is not recommend ed. 7. handling precautions splitting of pcb 1. when pcbs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. board separation shall not be done manually, but by using th e appropriate devices. mechanical considerations be careful not to subject capacitors to excessive mechanical sh ocks. 1if ceramic capacitors are dropped onto a floor or a hard sur face, they shall not be used. 2please be careful that the mounted components do not come in contact with or bump against other boards or compo nents. 8. storage conditions precautions storage 1. to maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the s torage area. humidity should e specially be kept as low as possible. ?recommended conditions ambient temperature : below 30 humidity : below 70% rh the ambient temperature must be kept below 40. even under idea l storage conditions, solderabilit y of capacitor is deteriorate d as time passes, so capacitors shall be used within 6 months from t he time of delivery. ?ceramic chip capacitors shall be kept where no chlorine or sul fur exists in the air. 2. the capacitance values of high dielectric constant capacitor s will gradually decrease with th e passage of time, so care shall be taken to design circuits . even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour. technical considerations if capacitors are stored in a high temperature and humidity env ironment, it might rapidly cause poor solderability due to term inal oxidation and quality loss of taping/packaging materials. for this reason, ca pacitors shall be used within 6 months from the time of deliver y. if exceeding the above period, please check solderability be fore using the capac itors. rcr-2335bsafety application guid e for fixed ceramic capacitor s for use in electronic equipmentis published by jeita. please check the guide regarding precautions for deflection te st, soldering by spot heat, and so on.

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